The optimum spacing between parallel heat generating boards cooled by laminar forced convection

Bu çalışmada laminer zorlanış taşınımla soğutulan sabit hacimli elektronik paket içerisine yerleştirilmiş paralel kartlardan ısı transferi sayısal olarak incelenmiştir.Calışmanın amacı elektronik paketten maksimum ısı transferi için, kartlar arasındaki optimum aralığın belirlenmesidir. Optimum aralığın belirlenmesinde kartlar arasındaki aralıklar eşit varsayılmış, ve basınç düşümü de sabit alınmıştır. Kartlar arasındaki gelişmekte olan laminer hava akışı, kart yüzeylerinde sabit sıcaklık ve sabit ısı akısı ısıl sınır şartlarında incelenmiştir. Sayısal çözümler laminer akışda optimum kart aralığının ısıl sınır şartlara bağlı olmadığını göstermektedir.

Laminer zorlanmış taşınım ile soğutulan ısı üreten paralel levhalar arasındaki en uygun aralığın belirlenmesi

Laminar forced convection heat transfer in parallel heat generating board in fixed volume of electronic package is investigated numerically. The main objective of this study is to maximize the total rate of heat transfer from the package to the air that flows through it. The boards are equidistant and the constraint of the optimization procedure is the constant pressure drop maintained across the electronic package for varying spacing of the heat-generating boards. The optimal board spacing that maximizes the total heat transfer rate is determined. Board surfaces with both uniform temperature and uniform heat flux are considered. The results of the optimization procedure show that the type of thermal boundary condition practically has no effect on the optimal board-to-board spacing.

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