WETTING BEHAVIORS AND INTERFACIAL PROPERTIES OF SAC300, SAC305 AND SAC0307 TERNARY Pb-FREE SOLDER ALLOYS

The wetting behavior and interfacial properties of molten SAC300, SAC305 and SAC0307 (Sn-Ag-Cu) Pb-free solder alloys were investigated by sessile drop technique at various temperatures (250, 280 and 310°C) on Cu substrate in Ar atmosphere, as well as its dependence on time. The contact angles of the Pb-free solder alloys on Cu substrate do not decrease sharply with increasing temperature but change with time. The contact angles were measured for SAC305, SAC300 and SAC0307 alloys and the lowest θ was obtained as 41.90°for SAC305 alloy at 310°C. The melting temperatures were examined which for SAC305 Pb-free alloy is lower than those for SAC300, SAC0307 Pb-free alloys. The formation of intermetallic compounds (IMC) between the Pb-free solder alloys and the Cu substrate was observed.

Anahtar Kelimeler:

Pb-free Solder Alloy, Contact Angle, Sessile Drop Technique, IMC

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