USING OF FLOW ROUTING PLATE FOR COOLING OF PRINTED CIRCUIT BOARDS
Effective cooling of electronic
components plays an important role in system design and efficiency. In this
study, the effects of using the flow routing plate in cooling printed circuit
boards have been investigated. For this purpose, effects of the flow routing
plate on the laminar mixed convection heat transfer from protruded heat sources
at the side walls of the horizontal channel, were investigated numerically. The
air was used as cooling fluid, and protruded heat sources were equipped as rows
into the rectangular channel with insulated walls. Numerical investigations
were carried out for different plate inclination angles at different Reynolds
and modified Grashof numbers. It is observed that the using of flow routing
plate increases the heat transfer at different ratios by comparison to the case
without plate and enhances the cooling conditions for all values of parameters
in the analyses. The highest heat transfer enhancement occurred at values where
Reynolds number (Re) was Re = 1000 and plate inclination angle (α) was α = 60
°.The results obtained during the numerical analyses are presented in detail in
the form of graphics for the row averaged Nusselt number, heater temperatures,
velocity vectors, and temperature contours.
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