A LOOP THERMOSYPHON FOR LIQUID COOLED MINICHANNELS HEAT SINK WITH PULSATE SURFACE HEAT FLUX

The period operation of power electronic acts as switching element, where the power dissipated consists of pulses at certain duty cycle, the semiconductor temperature oscillates and varies as a waveform. In the present study, an experimental investigation was carried out for a loop thermosyphon order to evaluate the effect of pulsate surface heat flux on the single-phase buoyancy driven convection of ethylene glycol flow through a minichannels heat sink with hydraulic diameter 1.5 mm. An electric heater block is used to supply the heat flux to minichannels heat sink in a rectangle waveform. The study is done at different heat flux frequencies of 2.777×10-3 Hz, 8.333×10-4 Hz, 5.555×10-4 Hz and 4.166×10-4 Hz, while the heat flux amplitude (2 watt), Rayleigh number (1864) and duty cycle (50 %) are kept constant. The results revealed that for a range of the measured frequency for the complete power cycle and due to unsteady state operation conditions, the pulse heat flux pattern is close to a rectangle-wave, this generates the fluid outlet temperature pattern close to a triangle-wave. The fluid outlet temperature increases with the decreases of heat flux frequency and tends to reach to the fluid outlet temperature for a constant and continuous heat flux case. Due to closed-loop of thermosyphon, the fluid inlet temperature is changed in pattern like that the fluid outlet temperature change.

___

  • [1] Jha, Chandra Mohan. Thermal Sensors_Principles and Applications for Semiconductor Industries. Principles of Chemical Sensors, 2009. https://doi.org/10.1007/b136378_3.
  • [2] Künzi, R. Thermal Design of Power Electronic Circuits. In CERN Accelerator School: Power Converters, CAS 2014 - Proceedings, 2018;311-327. https://doi.org/10.5170/CERN-2015-003.311.
  • [3] Miller, T.J.E. Power Electronics Devices, Drivers and Applications. Electronics and Power, 1987. https://doi.org/10.1049/ep.1987.0287.
  • [4] Al-Tae'y, K. A. , Eqbal H.A. and Jebur M. N. Experimental investigation of water cooled minichannel heat sink for computer processing unit cooling, Int. Journal of Engineering Research and Application, 2017; 38-49. https:// doi.org/10.9790/9622-0708013849
  • [5] Mallik, Sabuj, and Franziska Kaiser. Reliability Study of Subsea Electronic Systems Subjected to Accelerated Thermal Cycle Ageing. In Lecture Notes in Engineering and Computer Science, 2014. https://gala.gre.ac.uk/id/eprint/12319/.
  • [6] Yeo, Jiwon, Seiya Yamashita, Mizuki Hayashida, and Shigeru Koyama. A Loop Thermosyphon Type Cooling System for High Heat Flux. Journal of Electronics Cooling and Thermal Control, 2014;128-137. https://doi.org/10.4236/jectc.2014.44014.
  • [7] Ghobadi, Mehdi, and Yuri S. Muzychka. Heat Transfer and Pressure Drop in Mini Channel Heat Sinks. Heat Transfer Engineering, 2015;902-911. https://doi.org/10.1080/01457632.2015.965097.
  • [8] Hetsroni, G., A. Mosyak, and Z. Segal. Nonuniform Temperature Distribution in Electronic Devices Cooled by Flow in Parallel Microchannels. IEEE Transactions on Components and Packaging Technologies, 2001;16-23. https://doi.org/10.1109/6144.910797.
  • [9] Hejcik, Jiri, and Miroslav Jicha. Single Phase Heat Transfer in Minichannels. In EPJ Web of Conferences, 2014. https://doi.org/10.1051/epjconf/20146702034.
  • [10] Mehta, Balkrishna, and Sameer Khandekar. Local Experimental Heat Transfer of Single-Phase Pulsating Laminar Flow in a Square Mini-Channel. International Journal of Thermal Sciences, 2015;157-166. https://doi.org/10.1016/j.ijthermalsci.2015.01.008.
  • [11] Toyoda, Hiroyuki, and Yoshihiro Kondo. Heat Transfer Performance of Loop Thermosyphon Using Enhanced Boiling and Condensation Surfaces. Transaction on Control and Mechanical Systems, 2013;432-435.
  • [12] Jajja, Saad Ayub, Wajahat Ali, Hafiz Muhammad Ali, and Aysha Maryam Ali. Water Cooled Minichannel Heat Sinks for Microprocessor Cooling: Effect of Fin Spacing. Applied Thermal Engineering, 2014;76-82. https://doi.org/10.1016/j.applthermaleng.2013.12.007.
  • [13] Xie, X. L., Z. J. Liu, Y. L. He, and W. Q. Tao. Numerical Study of Laminar Heat Transfer and Pressure Drop Characteristics in a Water-Cooled Minichannel Heat Sink. Applied Thermal Engineering, 2009;64-74. https://doi.org/10.1016/j.applthermaleng.2008.02.002.
  • [14] Joseph, A. and Rajkumar, M. R. A numerical study on natural convection in mini channel using water and water- alumina nanofluid, 10th National Conference on Technological Trends, 2009, pp. 119-124.
  • [15] Asif, A., Samee, M. and Khanm S. A.,. Comparative heat transfer analysis in different minichannel heat sinks, International Journal of Recent Research, 2017, pp. 41-45.
  • [16] Dabrowski, Pawel, Michal Klugmann, and Dariusz Mikielewicz. Selected Studies of Flow Maldistribution in a Minichannel Plate Heat Exchanger. Archives of Thermodynamics, 2017;135-148. https://doi.org/10.1515/aoter-2017-0020
  • [17] Muhammad, Nura Mu’Az, Nor Azwadi Che Sidik, Aminuddin Saat, and Bala Abdullahi. Effect of Nanofluids on Heat Transfer and Pressure Drop Characteristics of Diverging-Converging Minichannel Heat Sink. CFD Letters, 2019;104-119.
  • [18] Turkyilmazoglu, M. “MHD Natural Convection in Saturated Porous Media with Heat Generation/Absorption and Thermal Radiation: Closed-Form Solutions.” Archives of Mechanics, 2019;49-64. https://doi.org/10.24423/aom.3049.