M. A MUJEEBU, M. Z ABDULLAH, M. K ABDULLAH, B. H MURNI, F HUSSIN, H YUSOFF, N. C ISMAIL, K. A AHMAD, Z MOHD RIPIN

Heat transfer enhancement using piezoelectric fan in electronic cooling - experimental and numerical observations

Piezoelektrik fan taşınabilir elektronik ürünlerde ısının uzaklaştırılması için yernilikçi bir tasarım ve uygun birçözümdür. Boyutları küçük, düşük güç tüketimi ve düşük gürültü seviyesine sahiptir. Bu makalede piezoelektrik fantarafından hareketlendirilen sıkıştırlamaz üç boyutlu akış ve ısı transferi bir Plastik Leaded Yonga Taşıyıcı (PLCC)paketi incelenmiş ve sunulmuştur. Piezoelektrik fan (piezofan) ısı kaynağı yüzeyine dik olarak iki farklı yüksekliktekonumlandırılmış (her bir durum için, normalize edilmiş aralık δ = G/lp ) ve performansı test edilmiş, temel durum(doğal taşınım veya fansız durum) ile kıyaslanmıştır. Akış alanı, parçacık görüntülemeli hız ölçer (PIV) sistemiaracılığıyla gözlenmiş ve ölçülmüştür. Her durum için ısı transfer katsayısı da hesaplanmıştır. Sonlu hacimler yöntemitabanlı hesaplamalı akışkanlar dinamiği programı FLUENT 6.3.2 dinamik ağ seçeneği kullanılarak ısı transferi veakış alanları incelenmiştir. Sonuç, piezofanın ısı transferini önemli ölçüde iyileştirdiğini, ve 0,106 olan normalizeedilmiş aralığın 0.0604 değerinden daha iyi soğuttuğunu göstermiştir. Deneysel sonuçlar sayısal sonuçlarla uyumiçerisindedirler.

Elektronik cihaz soğutmada piezoelektrik fan kullanımının ısı transferinin iyileştirilmesi – deneysel ve sayısal gözlemler

Piezoelectric fan is an innovative design and feasible solution to remove heat from microelectronic systemsfor portable electronic products. It is small in size, has low power consumption and minimal noise. This paperpresents experimental and computational investigations of incompressible three-dimensional streaming flows inducedby piezoelectric fan and the associated heat transfer enhancement, on a Plastic Leaded Chip Carrier (PLCC) package. Piezoelectric fan (piezofan) is arranged at two different heights normal to the heat source surface (in each case, thenormalized gap δ = G/lp) and tested for its performance, compared to the base case (natural convection or no fan). The flow field is observed and captured by means of a particle image velocimetry (PIV) system. The heat transfercoefficient in each case is also computed. The finite volume based computational fluid dynamics package, FLUENT6.3.2 is used to investigate the heat transfer coefficient and the flow fields using a dynamic mesh option. The resultshows that the piezofan yields significant improvement in heat transfer, and a normalized gap of 0.106 is offered abetter cooling compared to the 0.0604. The experimental results are in good agreement with the predicted results.Keywords: Electronic cooling, PLCC, Piezofan, Heat transfer coefficient.

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