Shakib Moqbel Ali Mohammed ALSOWIDY, Mohammed Ali SHUKRI

Stress-strain characteristics, dynamic recrystallization, grain growth, and melting point of the binary and ternary solder alloys

Stress-strain characteristics, dynamic recrystallization, grain growth, and melting point of the binary and ternary solder alloys

Turkish Journal of Physics

2011-Cilt: 35 - Sayı: 3

311-321

Solder alloys, stress-strain curves, dynamic recrystallization, work softening, mechanical properties, grain growth, plastic deformation

Solder alloys, stress-strain curves, dynamic recrystallization, work softening, mechanical properties, grain growth, plastic deformation

288