Thermal performance investigation of position function circuit board used in automotive exterior rear lighting
Thermal performance investigation of position function circuit board used in automotive exterior rear lighting
In this research, both numerically and experimentally, the thermal efficiency of a Printed Circuit Board (PCB) with two Light Emitting Diode (LED) chips was examined. The two LED lighting systems, which are single-cell LEDs, including PCB and copper plates, were manufactured, and tested under laboratory conditions to achieve this goal. The three-dimensional Computational Fluid Dynamics (CFD) model with natural convection effects prepared using the FloEFD software package to predict PCB surface temperature distributions. The goal was to perform comprehensive circuit board simulation and validate the numerical model built in this study using the experimental data during the studies. From the results, we can easily claim that higher temperature gradients are calculated and predicted near the LED chip because of heat generation. Data paths have played an essential role in the LED circuit board's temperature distribution. High-temperature variations are observed at short distances around the LED when the experimental and simulation results are compared. Temperature changes are minimized as they travel away from the LED chip. It is found that the error rate is below 5 percent overall between the experimental and simulation results. The numerical results were in proper alignment with numerical data obtained from the three-dimensional (3D) CFD model. Given thermal efficiency and using such models, this model can design and analyze Automotive Lighting Systems.
Keywords:
Automotive lighting, CFD, LED Heat transfer, Printed circuit board (PCB),
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- Başlangıç: 2012
- Yayıncı: Murat CİNİVİZ
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