New Optimal Heat Sink Design with Concave Fins for Cooling System in Light Emitting Diode Lamp

The heat sink is considered one of the most critical issues in designing and operating light-emitting diode (LED) lamps. The manufacturers in the technical catalogs indicate the maximum temperature tolerable by LED chips, which causes the light to drop and the color of the lamp output to change when this temperature range is not met. The selection and design of the cooling system usually affect the costs associated with the construction of the heat sink. This paper introduced a new heat sink system incorporating concave fins for the LED lamp cooling system. The numerical method was applied to solve the governing heat balance equations to examine this heat sink’s capability. The optimum geometry was determined to achieve minimum electronic chip temperature and heat sink weight at different LED lamp capacities based on the coupled numerical solution of heat transfer and particle swarm optimization (PSO) optimization algorithm. A comprehensive database was created and used as input for genetic planning tools based on two objective optimal solutions for different LED lamp capabilities. Based on genetic programming results, an analytical relation was presented to determine the optimal geometric parameters for LED power. Therefore, it is possible to determine the optimum geometry for a given power without numerical resolution and optimization. The efficiency and volume of sinks are significantly improved in optimal heat sinks with concave fins compared to fixed cross-sections based on the results.

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