Fault Detection Considerations in Silicon Based MEMS Resonators by Observing Changes in Dynamic Behaviour

Fault Detection Considerations in Silicon Based MEMS Resonators by Observing Changes in Dynamic Behaviour

This study is about fault detection in siliconbased MEMS resonators. The main idea in finding out the failure is to establish a proper relationship between the mechanical structure and its electrical equivalent and prosecuting related measurements. In order to determine the type of defect, the electrical equivalent circuit is referenced considering the parasitic effects. Among various possible faults cracks in the beam and particle adhesion are selected to verify the validity of the approach. Simulations are carried out to study the effect of defects on the resonance frequency and amplitude. Results coincide greatly with those of similar investigations giving motivation for further studies to penetrate deep into the matter, thus not being restricted with defining the trouble, but even locate the failure
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  • S. D. Senturia, “Microsystem Design”, Kluwer Academic Publishers, 2nd ed., Massachusetts, 2001.
  • T. Clark, C. Nguyen, L. P. B. Katehı, G. M. Rebeız, “Micromachined devices for wireless communications”, Proc. of the IEEE, vol. 86, no. 8, pp 1756-1768, Aug. 1998.
  • W.T. Hsui, T. Clark, C. Nguyen, “Stıffness-compensated temperature-ınsensıtıve mıcromechanıcal resonators”, Proc. of the IEEE, pp. 731-734, 2002.
  • N. Sepulveda, D. Aslam, J.P. Sullivan, “Polycrystalline diamond MEMS resonator technology for sensor applications”, Diamond & Related Materials, Elsevier, vol. 15, pp 398 – 403, 2006.
  • V. Kaajakari, “Theory and analysis of MEMS resonators”, VTI Technologies, 2011.
  • A. Izadian and P. Famouri, “Fault diagnosis of MEMS lateral comb resonators using multiple-model adaptive estimators”, IEEE Transactions on Control Systems Technology, vol. 18, no. 5, pp. 1233-1240, Sept. 2010.
  • N. Deb and R. D. Blanton, “High-level fault modeling in surface- micromachined MEMS” Design, Test, Integration, and Packaging of MEMS/MOEMS, Proceedings of SPIE, vol. 4019, pp. 228–235, May 2000.
  • R. Reichenbach, R. Rosing, A. Richardson, and A. Dorey, “Finite element analysis to support component level fault modelling for MEMS,” Design, Test, Integration, and Packaging of MEMS/MOEMS, Proceedings of SPIE, vol. 4408, pp. 147–158, April 2001.
  • Z. Chen, Y. Y. He, F. L. Chu, and J. Huang, “Dynamic characteristic analysis of the micro-structure with defects,” Chinese Journal of Mechanical Engineering, vol. 40, no. 6, pp. 23–27, 2004.
  • S. Mir, B. Charlot, and B. Courtois, “Extending fault-based testing to microelectromechanical systems,” Journal of Electronic Testing: Theory and Applications, vol. 16, no. 3, pp. 279–288, 2000.
  • D. Paci, M. Mastrangeli, A. Nannini, F. Pieri, “Modeling and characterization of three kinds of MEMS resonators fabricated with a thick polysilicon technology”, Analog Integr. Circ. Sig. Process., vol. 48, pp. 41–47, 2006.
  • M. W. Putty, S. C. Chang, R. T. Howe, A. L. Robinson, K. D. Wise, “One-port active polysilicon resonant microstructures”, Proc.IEEE Micro Electromechanical Systems, pp.60-65, Feb.1989.
  • S. Chowdhury, M. Ahmadi, W. C. Miller, “Pull-in voltage calculations for MEMS sensors with cantilevered beams”, IEEE- NEWCAS the 3rd International Conference, Québec City, Canada, vol. 19-22, pp.143 – 146, June 2005.
  • K. Tanaka, R. Kihara, A. S. Amores, J. Montserrat, “Parasitic effect