Cemile KEDİCİ ALP, Hanife ALTINIŞIK, Esra ÖZYURT

MTA Fillapex ile kontamine olmuş dentin yüzeylerine uygulanılan çeşitli kanal patı çözücülerinin adeziv rezinlerin bağlanma dayanımına etkisi

Amaç: Bu çalışmanın amacı, MTA Fillapex kök patı ile kontamine olmuş dentin yüzeylerine uygulanan farklı çözücülerin, adeziv rezinlerin pulpa odasındaki dentine mikrotensile bağlanma dayanımı (μTBS) üzerine etkisini değerlendirmektir. Gereç ve Yöntem: Bu çalışma da pulpa odası açılmış ve pulpa artıkları temizlenmiş 50 adet insan üçüncü azı dişi kullanıldı. Tüm dentin yüzeylerine 5 dk MTA Fillapex uygulandı, örnekler 5 gruba ayrıldı, kanal patı farklı solüsyonlarla temizlendi (n = 10). (Solüsyonun uygulanmadığı kontrol grubu, Kloroform, Metil etil keton, Etil asetat, Endosolv R). Örnekler kullanılan adeziv sisteme göre iki alt gruba ayrıldı. Clearfil Tri-S Universal Bond (Kuraray), üreticinin talimatlarına göre self etch ve total etch olarak uygulandı. Daha sonra dişler kompozit rezin ile restore edildi ve mikrotensile bağlanma dayanımı testi için kullanılacak çubukları üretmek üzere kesitler alındı. Elde edilen veriler ANOVA ve Tukey testi ile analiz edildi. Bulgular: Tüm total etch adeziv gruplarındaki ortalama μTBS değerleri, tüm self etch adeziv gruplarından istatistiksel olarak daha yüksekti (p 0.05). Sonuç: MTA Fillapex ile kontamine dentin yüzeylerine uygulanılan çözücüler self etch ve total etch adeziv rezinlerin bağlanma dayanımını etkilemektedir.

Anahtar Kelimeler:

Adeziv, MTA Fillapex, makaslama bağlanma dayanımı, solvent

The effect on the bond strength of adhesive resins of various resin sealer solvents applied to dentin surfaces contaminated with MTA Fillapex

Background: The aim of this study was to evaluate the effect of different endodontic solvents applied to the dentin surfaces contaminated with MTA Fillapex root canal paste on microtensile bond strength (μTBS) of adhesive resins to pulp chamber dentin. Materials and methods: 50 human third molars pulp chamber was perforated and the pulp residues were cleaned. MTA Fillapex was applied to all dentin surfaces for 5 min, the samples were divided into 5 groups, the paste was removed with different solutions. (n=10) (Without solution, Chloroform, Methyl ethyl ketone, Ethyl acetate, Endosolv R). The samples were divided into two subgroups according to the adhesive system used. Clearfil Tri-S Universal Bond (Kuraray) applied either self-etch mode and total-etch mode according to the manufacturer's instructions. The teeth were restored with a composite and sectioned to sticks for microtensile bond testing. Data were analysed by ANOVA and Tukey test. Results: The mean μTBS values in all total etch adhesive groups was statistically higher than the all self etch adhesive groups (p0.05). Conclusion: Treating methods affect the dentin bonding strength of self etch and total etch adhesives.

Keywords:

Adhesive, MTA Fillapex, microtensile bond strength, solvent,

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