Abdellatif MTIBAA, Badi GUIBANE, Belgacem HAMDI, Brahim BENSALEM

A novel efficient TSV built-in test for stacked 3D ICs

A novel efficient TSV built-in test for stacked 3D ICs

Turkish Journal of Electrical Engineering and Computer Sciences

2018-Cilt: 26 - Sayı: 4

1909-1921

48 52