Burcu CICEK, Necmettin SAHIN, Mahmut ALKAN

Thermal Analysis of Chip on Board Packaging of High Power Led’s with Heat Pipe Using Cfd for Street Lights

Gazi University Journal of Science

2018-Cilt: 31 - Sayı: 4

1229-1244

High Power LED's, CFD, Heat Pipe, Thermal analysis

110 101