Kadir MERCAN, Ömer CİVALEK
International Journal of Engineering and Applied Sciences
2018-Cilt: 10 - Sayı: 4
291-304
Modal analysis, microwires, nanowires, SiCNW, COMSOL
3418
Vebil YILDIRIM
Avtandil BARDAVELİDZE, Khatuna BARDAVELİDZE, İrakli BASHELEİSHVİLİ