Investigation of Bonding Performance of Polyurethane (Pur) Based Adhesives to Different Climate Conditions

This study was carried out to determine suitable wood type and glue to be used in wet-hot places (in the construction of saunas, baths and various marine vehicles), to determine the changes in adhesion performance at variable temperatures and sequential and individual processes by keeping the relative humidity constant in these areas. For this purpose, as wood material, Scotch pine (Pinus sylvestris Lipsky) and stemless oak (Quercus petrea spp.), glue as polyurethane based PA300 and PA301 adhesives were preferred. Wood material was supplied by random method.Test results in terms of bonding strength; sequential process adversely affected and decreased by 7 percent compared to the individual process. As wood type, 14 percent higher resistance was obtained in pine than oak. In terms of elasticity modulus; sequential process negatively affected and decreased by 1.4 percent compared to the individual process. As wood type, it was 10.5 percent with respect to oak, and 32.6 percent with higher elasticity than PA300 glue as glue type. In terms of elongation deformation in glue line; the sequential process adversely affected and reduced by about 19 percent compared to the individual process.

Investigation of Bonding Performance of Polyurethane (Pur) Based Adhesives to Different Climate Conditions

This study was carried out to determine suitable wood type and glue to be used in wet-hot places (in the construction of saunas, baths and various marine vehicles), to determine the changes in adhesion performance at variable temperatures and sequential and individual processes by keeping the relative humidity constant in these areas. For this purpose, as wood material, Scotch pine (Pinus sylvestris Lipsky) and stemless oak (Quercus petrea spp.), glue as polyurethane based PA300 and PA301 adhesives were preferred. Wood material was supplied by random method.Test results in terms of bonding strength; sequential process adversely affected and decreased by 7 percent compared to the individual process. As wood type, 14 percent higher resistance was obtained in pine than oak. In terms of elasticity modulus; sequential process negatively affected and decreased by 1.4 percent compared to the individual process. As wood type, it was 10.5 percent with respect to oak, and 32.6 percent with higher elasticity than PA300 glue as glue type. In terms of elongation deformation in glue line; the sequential process adversely affected and reduced by about 19 percent compared to the individual process.

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